What is a lead frame and what is its function

As the chip carrier of the integrated circuit, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to electrically connect the chip's internal circuit terminals and external leads to form an electrical circuit. When it comes to connecting to external wires, most semiconductor integrated blocks require the use of lead frames, which are important basic materials in the electronic information industry.
effect
As the chip carrier of the integrated circuit, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to electrically connect the chip's internal circuit terminals and external leads to form an electrical circuit. When it comes to connecting to external wires, most semiconductor integrated blocks require the use of lead frames, which are important basic materials in the electronic information industry.
product description
There are TO, DIP, ZIP, SIP, SOP, SSOP, TSSOP, QFP (QFJ), SOD, SOT, etc. It is mainly produced by mold stamping method and chemical etching method. The raw materials used in lead frames include: KFC, C194, C7025, FeNi42, TAMAC-15, PMC-90, etc. The selection of materials is mainly based on the properties required by the product: (strength, electrical conductivity and thermal conductivity).