characteristic
Copper alloys for lead frames are roughly divided into copper-iron series, copper-nickel-silicon series, copper-chromium series, copper-nickel-tin series (JK--2 alloy), etc., and multi-element series copper alloys such as ternary and quaternary It can achieve better performance and lower cost than traditional binary alloys. Copper-iron alloys have the largest number of grades and have good mechanical strength, stress relaxation resistance and low creep properties. They are a good type of lead. Frame material. Due to the needs of lead frame production and packaging applications, in addition to high strength and high thermal conductivity, the material is also required to have good soldering performance, process performance, etching performance, oxide film adhesion performance, etc. Materials are developing in the direction of high strength, high conductivity, and low cost. A small amount of various elements are added to copper to improve the strength of the alloy (making the lead frame less likely to deform) and overall performance, tensile strength, without significantly reducing the conductivity. Materials with conductivity above 600Mpa and greater than 80% IACS are research and development hotspots. And the copper strip is required to have a high surface, precise plate shape, uniform performance, and the thickness of the strip is constantly thinning, gradually thinning from 0.25mm to 0.15mm, 0.1mm, and ultra-thin and special-shaped from 0.07 to 0.07mm.
