Etched Lead Frame

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Product Introduction

Etched Lead Frame is an important component of semiconductor packaging. In the semiconductor industry, the pads and pins of the chip constitute its physical support and electrical connection with the PCB board. This package constitutes the basic structure of the Lead Frame. The Lead Frame is mainly composed of two parts: the chip pad (die paddle) and the pin (lead finger). The etched lead frame is a Lead Frame manufactured by a specific etching process, in which the chip pad provides mechanical support for the chip during the packaging process, and the pin is the electrical path connecting the chip to the outside of the package. Each pin end is connected to a pad on the chip through a lead. The end of the pin close to the chip is called the inner finger, and the other end is the pin, which is used to provide mechanical and electrical connection with the substrate or PC board. Its function is very important. On the one hand, it plays a supporting role in the packaged device, while preventing the molding plastic from suddenly gushing out between the leads, providing support for the plastic; on the other hand, it connects the chip to the substrate, providing an electrical and thermal channel from the chip to the circuit board.

Etched Lead Frames are important components used in a variety of electronic devices across multiple industries. These precision components provide a reliable electrical connection between semiconductor chips and external circuits. Lead frames are made of precision-manufactured metals that ensure excellent thermal and electrical conductivity, which is essential for the high performance and precision required for critical applications.

Etching Advantages

● OEM Photo Etching Precision Metal Parts
● Apertures on both sides as the etchant works on both sides of the metal
● Burr & Stress-free manufacturing method
● Custom parts - you design it - we make it!
● Cost-effective Prototyping
● Etch Tech can call on more than 30 years experience in the photo chemical etching of metal components
● High Accuracy
● Low cost tooling
● Industry leading lead times from inception to delivered components
● Prototypes - fast turnaround to meet your needs
● Scalable through Short Run to High Volume
● Customize any brand logo

Processing method of etched lead frame

Workpiece processing (etching) is the main processing method for manufacturing etched lead frame. It can be roughly divided into the following steps:

Mattress positioning hole: This is the starting step of the processing process, providing a positioning reference for subsequent tasks.
Double-sided photoresist coating: The processing of photoresist prepares for subsequent photolithography and other processes.
UV exposure through the mask plate, exposure, and curing: The photoresist is processed by penetrating the mask plate to expose the part that needs to be polished.
Corrosion of contact metal by chemical reagents (usually using reagents such as ferric chloride): The contact metal is corroded by chemical reagents to form the desired frame shape.
Removal of photoresist: Remove the previously applied photoresist to obtain the final etched lead frame.

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