Lead Frame Copper Alloy
First etching and then plating
NipdAu plating
China supplier precision metal chemical etching copper plate metal lead frame for semiconductor package
Three production processes & satisfy the need in the market.
First plating and then etching
First etching and then plating
NipdAu plating
Satisfy the need of IC bracket/semiconductor package
High Precision exposure process
Satisfy design of all type of leadframe
High reliability:
Surface micro-etching&electroplating
Copper roughening technology meets the high reliability requirements of current and future product








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